Modern Microelectronic solutions require many special package 
designs to meet ever-increasing performance demands.

Close liaison with package users is necessary if the optimum 
design is to be achieved. A design that takes into consideration 
all aspects of manufacture while meeting performance criteria 
will result in economic pricing and the shortest leadtimes
TWM Technology has many years experience in using the special 
materials needed for these packages.

Careful consideration is given to the choice of materials to be used to provide the best performance with the easiest construction techniques. Insulation for feedthroughs is provided with direct bonded glass or soldered/brazed ceramic. Different metals are joined together with a 
choice of solders or brazes or by welding. All parts are plated to 
customer specification in our own facility.

TWM TECHNOLOGY

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CUSTOM PACKAGES

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POWER PACKAGES

HYBRID PACKAGES

ASSEMBLY

MACHINING

PLATING