| Modern Microelectronic solutions require
many special package
designs to meet ever-increasing performance demands. Close liaison with package users is necessary
if the optimum
Careful consideration is given to the choice
of materials to be used to provide the best performance with the easiest
construction techniques. Insulation for feedthroughs is provided with direct
bonded glass or soldered/brazed ceramic. Different metals are joined together
with a
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TWM
TECHNOLOGY
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