TWM Technology's plating facility is
fully dedicated to components for
the Microelectronics Industry and as such
we understand the
requirements for such applications as wire-bonding
and resistance and laser-welding for lid sealing.
Successful plating depends to a great extent
on the quality of the metal
parts submitted and to the control of the
processes. Burr free and uncontaminated parts are transferred to our plating
facility in a condition
that ensures satisfactory results.
As well as conventional wire and rig plating,
our skills include selective
area deposition and plating of flexible circuits.
We have approvals and customers from international companies and organizations
such as GE, PerkinElmer, American Micro, BAE Systems, Lockheed-Martin,
NASA-JPL, Honeywell, Fairchild Imaging, JDS Uniphase, CMC Electronics and
numerous others. A rigid control of chemicals and processes, supported
by a comprehensive quality control laboratory, ensures consistent repeatability.